The Trion load locked system is configured for CF4, O2, SF6, CHF3, He, Ar, CH4, and H2 while the Technics system is configured for deposition for CF4, Ar, O2, and CHF3. The Trion RIE will accept wafers up to 200 mm diameter as well as parts and individual die. The Technics RIE will accept up to 200 mm diameter wafers.
This system is configured for deposition of SiO2 and Si3N4. It will accept wafers up to 200 mm diameter as well as parts and individual die.
The Drytek MS-6 is configured for etching in O2 and CF4, and the Anatech is for O2 etching only. Both systems can etch a wide variety of wafer sizes and parts.
Plasma Dynamics has onsite access to an Amray 3600 field emission microscope (www.pvdproducts.com) and offsite use of an additional Amray (www.microvisionlabs.com) for pre and post etch examination of samples.
Plasma Dynamics, LLC 2016